DSCC’s FOPLP and Glass Substrate Packaging Report Reveals Significant Growth Opportunities
December 23, 2024The Fan Out Panel Level Packaging (FOPLP) market, which includes glass substrate packaging (GSP), is expected to grow at a 29% CAGR to $2.9B. Numerous applications will benefit from FOPLP including AI, HPCs, Communication, Automotive, Displays, etc. AI and HPCs are expected to lead from 2026. Companies throughout the semiconductor and display supply chains are poised to benefit from the shift to FOPLP and GSPs.Read More