Artificial intelligence (AI) semiconductors are becoming so complex and large that chip makers and packaging suppliers are turning to glass substrates. This trend could be a major boon to display makers, display equipment suppliers and display materials producers. It is also an ideal solution for under-utilized older a-Si TFT LCD fabs which could be converted or sold for this application. Advantages of glass substrates include superior flatness and better thermal and mechanical stability which will allow for higher density and higher performance chip packages to support AI. Glass substrates enable more transistors to be connected in a single package and also enable the ability to assemble larger configurations of chiplets. Organic materials used in packaging will likely reach their limit by 2030 , they consume more energy than glass and also have expansion and warpage limitations. A growing number of panel, equipment and materials suppliers have already announced programs in glass packaging. Intel has said it is targeting glass substrate package solutions in the second half of the decade. BOE has said they intend to start producing glass substrate packages in 2026.

To respond to this market opportunity, DSCC is developing a report on the glass substrate packaging market entitled Annual Glass Substrate Packaging Report. The report will be available by the end of the year and will cover:

• An Overview of Semiconductor and Panel Level Packaging.
• FOPLP Market Outlook
• Key Technologies and Challenges for FOPLP
  • Process Flow
  • Process Challenges
  • Key Equipment
  • Key Materials
• Status of Key FOPLP Players
  • Fabs
  • Outsourced Semiconductor Assembly and Test (OSAT) Suppliers
  • Panel Makers
  • Substrate Suppliers
• Supply Chain for Key FOPLP Players
  • Fabs
  • Outsourced Semiconductor Assembly and Test (OSAT) Suppliers
  • Panel Makers
  • Substrate Suppliers
• FOPLP Market Forecast
  • By Region
  • By Type/Technology
  • By Application
• Other Advanced Packaging Technologies
  • Chip on Wafer on Substrate (CoWoS)
  • Integrated Fan-Out Package on Package (InFO_POP)

The report will be authored by DSCC Taiwan analyst Leo Liu and a leading packaging expert. For more information, contact [email protected].